EngD Program at TU/eThe post-master designer's program is a prestigious two-year salaried program in technological design, leading to an Engineering Doctorate (EngD) degree. It develops the trainee's capabilities to work within a professional engineering context in an application- and system-design-oriented setting.
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https://www.tue.nl/en/education/graduate-school/pdeng-at-tue/Description of the HiCONNECTS projectThe project is a large consortium of academic and research institutes and industrial partners trying to address the heterogeneous integration for connectivity and sustainability (HiCONNECTS). The high-level objective of HiCONNECTS is to support significant societal and industrial challenges by developing heterogeneous integration (HI) core technology solutions for energy-efficient and high-performance wireless/wired cloud and edge computing as well as automotive radar to solve two of the leading state-of-the-art roadblocks: the transmission of Internet of Things (IoT) data over the IT network and sensing of objects to enable Highly Automated Driving (HAD).
Today, high latency, limited bandwidth, and high energy consumption per bit of information of current wireless/cloud platforms cannot satisfy the IoT applications that require real-time response. Furthermore, a lack of resolution, classification, segmentation, localization, and mapping of current radars is insufficient for Level 4 and 5 HAD. The second and directly linked objective is to use these HI components to develop solutions in societal and economically important areas, with a significant focus on RF technologies (Wi-Fi, 5G/6G, and radar) and IT data growth infrastructure (networking cards and switches) for the advancement of vertical sectors such as connected vehicles, smart cities, and connected industry.
HiCONNECTS' s scope includes designing and manufacturing high-performance Radio Frequency (RF), energy-efficient cloud and edge Information Technology (IT) components and systems, and manufacturing technology enhancements. HiCONNECTS' s scope includes Heterogeneous integration' pilot lines at multiple partners, manufacturing partners, and critical applications demonstrators in Europe for the automotive, public safety, and life science and health industries, where efficient high-speed transmission of data is essential and relevant for society and the economic growth. The heterogeneous Integration equipment and modules manufacturers, RTOs, and academia are grouped within this envelope.
Tasks for the EngD in the projectFerdinand Braun Institute (FBH), with RTOs, academia, equipment manufacturers, IC, and packaging manufacturers, will establish and lead a pilot line that integrates high-speed electronics and photonics with broadband interconnect technology into a seamless module using heterogeneous integration (HI) technologies. The focus of pilot line 1 lies on high-speed wide bandwidth electronics development. The foreseen data throughput, as described above, necessitates instantaneous bandwidths well beyond 100 GHz. Direct-modulated laser and modulator photonic chips are flip-chip mounted to electronic driver amplifiers forming high data rate optoelectronic transmitting components. There is a push toward developing co-design methodologies for driver-modulator systems, which requires a rethink of the system architecture. This project will explore and develop a co-design methodology to facilitate a novel architecture for the electronic driver and optical modulator system. TU/e will employ a SiGe BiCMOS electronics technology, which will pave the way to the hetero-integration of InP electronic and photonic components. This HI approach will be followed beyond HiCONNECTS activities.